3D IC Integration and Packaging (Electronics) by John H. Lau PDF

By John H. Lau

ISBN-10: 0071848061

ISBN-13: 9780071848060

A finished advisor to 3D IC integration and packaging technology

3D IC Integration and Packaging totally explains the most recent microelectronics options for expanding chip density and maximizing functionality whereas decreasing strength intake. in keeping with a path constructed by means of its writer, this functional advisor bargains real-world problem-solving tools and teaches the trade-offs inherent in making system-level judgements. discover key permitting applied sciences akin to TSV, thin-wafer power size and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor snapshot sensors integration. meeting, thermal administration, and reliability are lined in whole detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and power measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS snapshot sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

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3D IC Integration and Packaging (Electronics) by John H. Lau

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