3D IC Integration and Packaging (Electronics) by John H. Lau PDF

By John H. Lau

ISBN-10: 0071848061

ISBN-13: 9780071848060

A finished advisor to 3D IC integration and packaging technology

3D IC Integration and Packaging totally explains the most recent microelectronics options for expanding chip density and maximizing functionality whereas decreasing strength intake. in keeping with a path constructed by means of its writer, this functional advisor bargains real-world problem-solving tools and teaches the trade-offs inherent in making system-level judgements. discover key permitting applied sciences akin to TSV, thin-wafer power size and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor snapshot sensors integration. meeting, thermal administration, and reliability are lined in whole detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and power measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS snapshot sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

Show description

Read or Download 3D IC Integration and Packaging (Electronics) PDF

Similar electrical engineering books

New PDF release: Computersimulation und rechnergestützte Systemanalyse der

Die Leistungselektronik spielt heute eine wichtige Rolle in den Bereichen: Antriebtechnik, Industrielle Elektronik, Elektrofahrzeuge und Energie Systeme. Die Lehrbücher bezüglich Leistungselektronik haben bisher nur die Schaltung dargestellt und die Funktionsweise erklärt. Dieses ist nicht ausreichend, weil die Schaltungen von Leistungselektronik sehr stark zeitlich diskret und nicht linear.

Stefano Longo,Tingli Su,Guido Herrmann,Phil Barber's Optimal and Robust Scheduling for Networked Control Systems PDF

Optimum and strong Scheduling for Networked regulate platforms tackles the matter of integrating procedure components—controllers, sensors, and actuators—in a networked keep watch over procedure. it's normal perform in to resolve such difficulties heuristically, as the few theoretical effects on hand are usually not finished and can't be with no trouble utilized by means of practitioners.

New PDF release: Elektronik in der Fahrzeugtechnik: Hardware, Software,

Heutige Fahrzeuge erreichen durch den Einsatz elektronischer Systeme bisher ungeahnte criteria bei den Emissionen, der Sicherheit und dem Komfort. Der in depth Elektronikeinsatz schafft aber auch neue Probleme. Das Buch vermittelt die Grundlagen, um die Besonderheiten der Elektronik und software program im Kfz nicht nur zu kennen, sondern auch zu verstehen.

CMOS RF Circuit Design for Reliability and Variability by Jiann-Shiun Yuan PDF

The topic of this booklet is CMOS RF circuit layout for reliability. The machine reliability and approach version concerns on RF transmitter and receiver circuits could be specific curiosity to the readers within the box of semiconductor units and circuits. This proposed publication is exclusive to discover usual reliability matters within the gadget and know-how point after which to check their impression on RF instant transceiver circuit functionality.

Additional info for 3D IC Integration and Packaging (Electronics)

Sample text

Download PDF sample

3D IC Integration and Packaging (Electronics) by John H. Lau


by Christopher
4.2

Rated 4.64 of 5 – based on 18 votes